Home » Blog » Cooler Master Thermal Pad 3.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9030-R1)

Blog

Cooler Master Thermal Pad 3.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9030-R1)

Tech Under 30

February 18, 2026

0 Views 0

SaveSavedRemoved 0

Price: $12.99
(as of Feb 18, 2026 03:18:23 UTC – Details)

Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.
Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
Double-sided Adhesive: Provides seamless and secure contact between surfaces
Versatile and Easy Application: Easily cut to the perfect size for your application